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RELATED ARTICLES品牌 | 其他品牌 | 应用领域 | 电子 |
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Pitch e(mm) | Ball Count | Package Size | Contac Matrix | Ball Dia.(mm) | Ball Height (mm) | Ball Composition | Part Numbe |
0.50 | 163 | 8X11 | 12X18 | 0.30 | 0.22 | Pb-free | 776B4163-101 |
0.65 | 154 | 8X10 | 11X14 | 0.30 | 0.20 | Eutectic | 776A3154-101 |
209 | 14X14 | 20X20 | 0.35 | 0.185 | Eutecti | 776A3209-501 | |
260 | 13X13 | 18X18 | 0.40 | 0.33 | Pb-free | 776A3260-101 | |
280 | 13X13 | 19X19 | 0.30 | 0.20 | Eutectic | 776A3280-101 | |
336 | 14X14 | 20X20 | 0.35 | 0.185 | Eutectic | 776A3336-501 | |
DESCRIPTION &ORDERING INFORMATION | MATERIALS &SPECIFICATIONS ·Socket Body:PES,PEI,LCP or Equivalent | ||||||
·Contact:Beryllium Copper Alloy ·Contact Plating:Gold | |||||||
·Contact Force:10 grams far Eutectic Solder Ball | |||||||
uct Numb | 17 grams for lead-free Solder Ball | ||||||
·Contact Resistance:200 mΩ ·Temperature Rating:150℃ ·Durability:10,000 cycles min. |